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Flip ChipsAlso known as a controlled collapse chip connection (C4), a flip chip is a method for interconnecting semiconductor devices to external circuitry. Known as a ‘flip’ chip because to mount the chip to external circuitry, the chip is flipped upside down.
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Flip Chipsare structures that house circuits interconnected face down directly to the substrate with solder bumpers without leads, and are utilized to minimize printed circuit board surface area when compact packaging is required.
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